发明名称 |
Semiconductor element with disk-shaped housing |
摘要 |
A disk-shaped housing for a semiconductor element comprising a cup (1) of insulating material with an opening (2) at the bottom. Through this opening (2) passes a contact surface (4) of one of two plate type connecting bodies (3), between which lies a pressure-contacted semiconductor body (14). Both connecting bodies (3, 5) comprise radially and axially oriented seal surfaces (8, 9; 11, 12), against which there abuts under pressure an elastic ring (13) which surrounds the semiconductor body. The cup is filled with sealing compound (18); the semiconductor body is thus protected against penetration of the sealing compound.
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申请公布号 |
US4607275(A) |
申请公布日期 |
1986.08.19 |
申请号 |
US19840586589 |
申请日期 |
1984.03.06 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
VOGT, HERBERT;EGERBACHER, WERNER;WUNDERLICH, DIETER;MITZKUS, WERNER |
分类号 |
H01L23/04;H01L23/051;H01L23/16;H01L23/48;(IPC1-7):H01L23/32 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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