| 摘要 |
PURPOSE:To obtain an excellent light emitting output even in a high current region, by using a conducting heat sink member and performing specified electrical connection in an assembly structure. CONSTITUTION:One end part of a conducting heat sink member 22 is fused to an electrode 17', which is formed on the surface of an LED chip 1 through Au/Sn solder. The other end part is bonded to a peripheral part 22 of a stem. A light conducting through hole 23 is provided at the conducting heat sink 22. The through hole 23 is provided so as to match the light conducting hole, which is formed in the surface electrode of the LED chip 1. The end surface of the through hole 23 is formed in a tapered shape. Since the heat sink 22 is located at the chip surface close to the light emitting area, heat yielded at the light emitting area is excellently radiated. Therefore current/light characteristics having excellent liniarity can be obtained even in a high current region. |
