发明名称 MULTILAYER WIRING STRUCTURE
摘要 PURPOSE:To prevent the occurrence of wiring breakdown, by specifying a ratio between the thickness of an interlayer insulating film and an interval between the first layer metal wirings. CONSTITUTION:When the thickness of an interlayer insulating film 4 becomes 1/2 or more of an interval between first layer aluminum wirings 3, a recess part 7 becomes almost invisible. With the interval between the first layer alumi num wirings being constant, the thicker the interlayer film 4 becomes, the smaller the recess part 7 tends to become. When the interlayer insulating film 4 becomes too thick and becomes larger than the interval between the first aluminum wirings 3, however, film stress becomes large, and cracks are yielded in the interlayer film. The depth of through-hole contact connecting the second layer aluminum wirings and the first layer aluminum wirings becomes deep, and wiring breakdown occurs in the second layer aluminum wirings at the contact part. Therefore, it is suitable that the thickness of the interlayer insulat ing film 4 is 1/2-1 times the interval between the first aluminum wirings.
申请公布号 JPS61184847(A) 申请公布日期 1986.08.18
申请号 JP19850024735 申请日期 1985.02.12
申请人 NEC CORP 发明人 YAMAZAKI TORU
分类号 H01L21/3205;(IPC1-7):H01L21/88 主分类号 H01L21/3205
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