| 摘要 |
<p>PURPOSE:To minimize the area occupied by repairing pads in the substrate surface, by a method wherein a terminal resistor incorporated in the repairing pad which leads out the I/O terminals of the LSI and signal wiring in the substrate are connected with through-holes and lead-out patterns. CONSTITUTION:A thick film wiring layer 23 is a thick film substrate using e.g. alumina for the insulator and tungsten for the conductor, where a signal wiring 12 by which the I/O terminals of the LSI 11 combine the I/O terminals of a module is formed, and terminal resistors 21 made of chromium or the like are prepared on the surface. On the thick film substrate, a thin film wiring layer 22 using e.g. polyimide for the insulator and alumina for the conductor and incorporating a lead-out wiring 17 and through-holes 16a, 16b, 18, and 19 by techniques such as evaporation and etching. On the surface, CCB pads 15 to be connected to CCB solder bumps 14 of the LSI 11 and repairing pads 13 for test repairing are prepared in a necessary number.</p> |
