发明名称 ADHESIVE COMPOSITION FOR FLEXIBLE PRINTED CIRCUIT BOARD
摘要 PURPOSE:To obtain an adhesive having excellent adhesion, resistance to heat and deterioration by heat, flame retardance and processability, by blending an acrylic elastomer, a phenolic resin, an epoxy resin, a curing accelerator and an inorg. filler. CONSTITUTION:An adhesive compsn. contains an acrylic elastomer (A) contg. a functional group selected from among epoxy, carboxyl and hydroxyl groups, a phenolic resin (B) obtd. by graft-polymerizing a rubber elastomer, an epoxy resin (C), a curing accelerator (D) and an inorg. filler (E). As said acrylic elastomer, those contg. an epoxy group are preferred, because they can react at a low temp. Pref. component A is used in a quantity of 30-70wt% based on that of the resin component. Pref. the phenolic resin (B) is used in such a quantity as to give an equivalent ratio of the phenolic hydroxyl group (b) to the epoxy group (c) in the epoxy resin of 0.6-1.1.
申请公布号 JPS61183373(A) 申请公布日期 1986.08.16
申请号 JP19850022796 申请日期 1985.02.09
申请人 TOSHIBA CHEM CORP 发明人 MATSUDA ITSUO;TOMONAGA KAZUYUKI;YAYOSHI MASAKAZU
分类号 H05K1/03;B32B7/12;C08G59/00;C08G59/32;C08G59/62;C08J5/12;C08L33/00;C08L33/02;C08L51/00;C08L51/02;C08L63/00;C08L77/00;C09J163/00 主分类号 H05K1/03
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