| 摘要 |
PURPOSE:To make the temperature distribution of the stage top more uniform, by a method wherein temperatures close to the true temperature of wafers are obtained by enabling thermosensors embedded with a thermocouple to an object of the same in thickness, surface state, and thermal properties as those of the wafer that is an object to be measured to be fixed on the stage by the same means as that for the object to be measured. CONSTITUTION:A semiconductor 1 that is the sample is fixed on a stage 2 by vacuum chuck. A heater 3 in the stage 2 makes the temperature distribution uniform in the stage top by spiral form instead of linear or annular form. A plurality of thermosensors 4 for temperature measurement are fixed on top of the stage 2 around the wafer 1 by vacuum chuck 1. The thermosensor 4 is prepared by grooving a semiconductor chip, putting the tip of a thermocouple 52 into the groove, and fixing it with adhesive. The depth of the groove is preferable about 200mum, and an adhesive good in thermal conductivity with electrical insulation is selected. |
