| 摘要 |
PURPOSE:To make the thickness of a thin film uniform by bonding a target metal to a backing plate with a thin filmlike filler metal so as to form a uniform bonding layer. CONSTITUTION:A target 10 for forming a thin film is obtd. by bonding the target metal 13 to the backing plate 14 with the thin filmlike filler metal 18 obtd. by solidifying a molten metal by a rapid cooling. By such a manner, the uniform bonding layer is formed, giving uniform heat conductivity and uniform cooling power, so the thickness of the thin film formed by the vapor deposition is made uniform. |
