| 摘要 |
PURPOSE:To obtain the titled material superior in conductivity, strength and electrical plating property, by adding, incorporating specified quantities of Cr, Zr to Cu. CONSTITUTION:As for lead frame material in semiconductor electron inductry, Cu alloy contg. 0.2-1.5% Cr, <0.5% Zr is melted to prepare ingot. This ingot is scalping treated, then held at 950-1,000 deg.C for 2-3hr, then hot rolled to plate material. Next, said plate is cold rolled including intermediate annealing at <=570 deg.C, then annealed finally to prepare annealed sheet having about 0.25mm thickness. Heterogemous phases of Cr, Zr ppt.s having <=0.5mum size are dispersed finely and uniformly in lead frame sheet made of ppt. type Cu alloy, and lead frame superior in conductivity, strength and also in Ag plating adhesive property is obtd. |
