发明名称 SPUTTERING DEVICE
摘要 PURPOSE:To make possible the formation of a thin film to a sample which is large in size and is required to have an extremely small film thickness distribution by dividing the conventional film thickness adjusting plate and adjusting individually the divided plates. CONSTITUTION:A shielding plate 8 which limits an electric discharge region is attached to the periphery of a cathode 7 disposed, a target b on the surface thereof and a sample holder 4 which supports the samples 5 to be formed there on with the thin film on one surface is disposed above the target 6. The film thickness correcting plate 3 is provided between the target 6 and the holder 4 and is connected via a roller 10 to a driving mechanism 9. The locus of the roller 10 driven by the mechanism 9 is changed. The locus of the roller 10 is directly the change of the plate 3 in the moving direction of the sample. The free adjustment of the region where the material scattering from the target 6 sticks on the sample 5 is thus made possible.
申请公布号 JPS61183464(A) 申请公布日期 1986.08.16
申请号 JP19850022428 申请日期 1985.02.07
申请人 NEC CORP 发明人 HIRAGA TAIJI
分类号 C23C14/34;(IPC1-7):C23C14/34 主分类号 C23C14/34
代理机构 代理人
主权项
地址