| 摘要 |
<p>987,524. Making semi-conductors; extruding; forging; welding by pressure. NIPPERT ELECTRIC PRODUCTS CO. July 15, 1963 [Dec. 21, 1962], No. 27921/63. Headings B3A, B3H, B3P and B3R. [Also in Division H1] A cup-shaped mount 26, Fig. 8, for a semiconductor is made by fusing a metal weld element 36, Fig. 1B, to the top surface of a billet 28 and then backwardly extruding the billet to work hardened cup shape in a die 20, Fig. 2. The billet may be of copper, copper alloy or a copper zirconium alloy as disclosed in Specification 838,981 and is formed by heading wire stock to provide a spigot 30 on which is located a brazing ring 34 and the weld ring 36. In a modification, Fig. 1C (not shown), the billet has a recess in its upper surface to facilitate the subsequent extrusion. The assembled workpiece is first heated in a furnace with a hydrogen atmosphere to braze the weld ring to the billet. Then the workpiece is placed in die cavity 38, Fig. 2, and backwardly extruded by punch 22. The lower die 20 is preferably carried by an index table which subsequently moves it under a second punch 24, Fig. 4, having an inner portion 44 to hold down the workpiece and an outer portion 46 which upsets the rim into a flange 54 and also forms a weld projection 58. A knockout pin 62 ejects the workpiece from the die 20. In another embodiment, Figs. 5-7 (not shown), the workpiece is formed completely at a single station using a composite punch. The semi-conductor element 64, Fig. 8, is secured to the mount 26 by soft solder 68 and a cover 70 is then welded to the weld ring 36. The element is connected by a strip 80, to a conductor 74 passing through a dielectric disc 76 and an insulating bushing 79 of ceramic or glass.</p> |
