发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To simplify connecting work by bonding and loading a semiconductor element and a plurality of external leading-out lead sections so as to be positioned in predetermined positional relationship onto an insulator and connecting an electrode for the element and the lead sections. CONSTITUTION:A conductor 11 and an insulator 13 are prepared, and the conductor 11 is bonded onto the insulator 13 so that lead members 14 and elements 12 are positioned at prescribed positions. Electrodes for the elements 12 are connected to the lead members 14 by wires. Accordingly, only the width of the insulator is varied, thus corresponding to pellets having all shapes while simplifying connecting work.
申请公布号 JPS61181153(A) 申请公布日期 1986.08.13
申请号 JP19850022413 申请日期 1985.02.07
申请人 NEC CORP 发明人 YAMASHITA HISANORI
分类号 H01L23/50;H01L21/60 主分类号 H01L23/50
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