| 摘要 |
PURPOSE:To suck and pass the tip of a thin wire through the hole of a die uniformly through liquid by dropping and filling liquid in the die hole when passing the tip of the thin wire through the die hole by suction of a vacuum pump. CONSTITUTION:A die 9 for wire drawing is placed on a die rest 6 through a rubber packing 10. When inside of a die holding fitting 5 is evacuated by a vacuum pump 1, inside of the die holding fitting 5 reaches low vacuum state causing slight leaking from a die hole 8, and the die 9 comes into close contact with the die rest 6. Then, the tip of a thin wire 11 having thinned tip is brought into contact with the die hole 8 sucking air, and at the same time, liquid such as water etc. is dropped from a supply port 12 to the die hole 8 to fill the die hole with the liquid. Then, the liquid is sucked in the die hole, and at the same time, the tip of the thin wire passes through the die hole.
|
