发明名称 |
Lead frame coated with aluminum as a packaging material in integrated circuits |
摘要 |
The present invention relates to an improvement of a packaging material for use in integrated circuits (IC) such as IC, LSI and VLSI, and in particular to an improvement of a lead frame made of iron-nickel alloys used as a material in a low-melting-point glass-ceramic package. The invention resides in provision of a lead frame faces made of an iron-nickel alloy substrate containing nickel therein at a ratio of 42 to 49% by weight and the improvement wherein an aluminium layer of 0.2 to 10 microns thick is coated on both faces and sides of the substrate.
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申请公布号 |
US4605533(A) |
申请公布日期 |
1986.08.12 |
申请号 |
US19850725202 |
申请日期 |
1985.04.19 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
KUDOH, KAZUNAO;HASHIMOTO, YOSHIKAZU |
分类号 |
B32B15/01;H01L23/495;(IPC1-7):C22C38/08 |
主分类号 |
B32B15/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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