| 摘要 |
PURPOSE:To detect the electrical generation of positional displacement, and to remove a product under the state of joining having little reliability initially as a defective by forming a dummy pattern near a substrate pad to be joined with a bump for an IC chip. CONSTITUTION:One parts of the contours of dummy patterns 3a, 3b, 3c, 3d each have shapes along the contours of conductor pads 1a, 1d, 1e, 1h, and are arranged at some predetermined distances from the pads. the distances are changed according to the magnitude of the quantity of positional displacement permissible among bumps for an IC chip and substrate pads. When the bumps 5a-5h for the IC chip 4 and the substrate conductor pads 1a-1h are position- displaced at tolerance limits or more and joined, the bump such as the bump 5a is also brought into contact with the dummy pattern 3a simultaneously. Accordingly, the substrate pad 1a and the dummy pattern 3a are short-circuited electrically, thus detecting positional displacement at tolerance limits or more when the open-short-circuit of 1a and 3a is inspected electrically. |
