Radiator heater solder pouring process

摘要

This is a process relating to improvements in the soldering of headers to conventional radiators. Tubular members of the radiator extend through holes in the header. The tubes are initially sealed to the header with a solder having a high temperature melting point T1. Infrared heat heats the header to a temperature T2 which is less than T1 but above a lower temperature T3 which is the melting temperature of a second solder. Upon the header reaching a selected temperature T2, a selected amount of the second solder in a molten state is poured in the header to puddle the entire pan area of the header, and allowed to cool to form a very strong soldered connection.