RESIN COMPOSITION FOR SOLDER-RESIST

摘要

PURPOSE:To obtain a film superior in resistances to heat and chemicals, printing characteristics, and adhesiveness to the base plate of a printed circuit by mixing glycidyl ether, specified polymaleimide, an amine type hardener, and an alkyl cellosolve type solvent. CONSTITUTION:The resin compsn. consists of A, glycidyl ether; B, polymaleimide in an amt. of 10-120, preferably, 15-50pts.wt. of 100pts.wt. of A; C, an amine type hardener in an amt. of 4-35pts.wt. per 100pts.wt. of A+B; and D, 20-100 pts.wt. of an alkyl cellosolve solvent per 100pts.wt. of A+B+C. When B is added in an amt. of below 10pts.wt., enhancement of the heat resistance is poor, and when above 120pts.wt., adhesion between the solder resist and the base plate of the printed circuit is deteriorated.