发明名称 Method of controlling printed circuit board solder fillets and printed circuit boards including solder fillet control patterns
摘要 A solder fillet control pattern provides a predictable solder quality control for the components mounted on printed circuit boards. The pattern can include a plurality of solder fillet control boxes, which define the individual component locations. The pattern allows for a greatly increased component packing density on the boards without increasing soldering defects.
申请公布号 US4605987(A) 申请公布日期 1986.08.12
申请号 US19830564131 申请日期 1983.12.22
申请人 MOTOROLA, INC. 发明人 ALLENSWORTH, DANA R.
分类号 H05K1/02;H05K3/34;(IPC1-7):H05K1/18 主分类号 H05K1/02
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