发明名称 ELECTROLYTIC PLATING BATH
摘要 PURPOSE:To reduce the dependency of coersive force upon film thickness in the obtained magnetic plating film by incorporating the ions of Co, Mn, and Ni, a reducing agent for these metallic ions, a pH buffer and the like. CONSTITUTION:The electrolytic plating bath contains Co ions, Mn ions, Ni ions, a reducing agent for these metallic ions, a pH buffer, and a pH modifier. The magnetic plating film obtained by use of this plating bath has reduced dependency of coersive force upon film thickness and shows excellent properties as a vertical magnetization recording medium used for a high density magnetic recording body.
申请公布号 JPS61179891(A) 申请公布日期 1986.08.12
申请号 JP19850019746 申请日期 1985.02.04
申请人 SHIN ETSU CHEM CO LTD 发明人 IIDA TAMAKI;KITAMURA HAJIME
分类号 C25D3/56;H01F10/00;H01F41/26 主分类号 C25D3/56
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