发明名称 |
LOW-STRESS-INDUCING OMNIDIRECTIONAL HEAT SINK |
摘要 |
<p>LOW-STRESS-INDUCING OMNIDIRECTIONAL HEAT SINK Disclosed is a heat sink for cooling an integrated circuit package. The heat sink comprises a single thin sheet of material having two oppositely facing major surfaces. These two major surfaces have a common perimeter defining a plurality of spaced-apart finger-shaped portions of the thin sheet of material that extend radially from a central portion of the sheet. The central portion is flat for attachment to the integrated circuit package; and the finger-shaped portions are formed to extend out of the plane of the central portion to become cooling fins for the central portion.</p> |
申请公布号 |
CA1209719(A) |
申请公布日期 |
1986.08.12 |
申请号 |
CA19830427463 |
申请日期 |
1983.05.04 |
申请人 |
BURROUGHS CORPORATION |
发明人 |
LEWIS, TERRENCE E.;SMILEY, STEPHEN A.;RICE, REX |
分类号 |
H01L23/367;H01L23/40;(IPC1-7):H01L23/34 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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