发明名称 Semiconductor device with interdigitated electrodes
摘要 A semiconductor device, such as a gate turn-off thyristor, has, at a major surface of a semiconductor body a plurality of electrode fingers alternately contacting opposite conductivity type regions (e.g. the cathode and gate) of the semiconductor body. In order to save useful semiconductor area and to allow an improved electrode geometry bonding pads for the electrodes are formed at a level above the electrodes. An insulating layer separates the bonding pads and the electrodes. A first bonding pad contacts a first set of electrode fingers through a first set of windows in the insulating layer and a second bonding pad contacts a second set of electrode fingers through a second set of windows. In operation, the voltage drop along each electrode finger of a set is substantially equal. A third bonding pad may also contact the second electrode set through a third set of windows in the insulating layer.
申请公布号 US4605949(A) 申请公布日期 1986.08.12
申请号 US19840634892 申请日期 1984.07.26
申请人 U.S. PHILIPS CORPORATION 发明人 MOORE, MICHAEL J.;PAXMAN, DAVID H.
分类号 H01L23/482;(IPC1-7):H01L23/48 主分类号 H01L23/482
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