| 摘要 |
PURPOSE:An epoxy resin composition excellent in flexibility, moisture resistance, adhesion, electrical properties, etc., and suitable for use in electronic parts, obtained by mixing an epoxy resin of a specified epoxy equivalent with a mononuclear or binuclear phenol compound. CONSTITUTION:The purpose epoxy resin composition is obtained by mixing an epoxy resin (A) of an epoxy equivalent of 110-1,500g/eq. (e.g., bisphenol A epoxy resin) with at least one phenolic compound (B) selected from among mononuclear dihydric phenols (e.g., resorcinol) and binuclear dihydric phenols (e.g., bisphenol A). The flexibility can be further improved by adding a carboxyl group- or amino group-terminated polybutadiene or butadiene/acrylonitrile copolymer. If desired, it is also possible to add a filler, a flame retardant, etc., to the resin composition.
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