| 摘要 |
PURPOSE:To lessen the impact in contact, and to prevent the mutual abutment of the upper packages in transportation, by a method wherein the whole of the upper package is made so as to round, and the lower package is made larger than the upper one in diameter. CONSTITUTION:The part of change from one surface to the other side surfaces and that between the other side surfaces are formed in arc, and a semiconductor chip is packaged with the upper package tapered in the other side surfaces and the lower package formed larger in diameter than the upper package. For example, the upper package 2 of an EPROM IC 1 is made of a piece of boro-silicate glass, and the lower package 3 a piece of plastic. The upper and lower packages 2 and 3 are fixed into an integral body by the fusion of low melting point glasses 4, 5. The internal structure of the IC 1 is: a recess 11 is formed in the lower package 3 made of plastic; an IC chip 12 is fixed in the recess 11 by the fusion of a low melting point glass 13; and each tab of the IC chip 12 is bonded to each lead 6 with a lead wire 14. |
