| 摘要 |
PURPOSE:To improve the bondability by a method wherein a bonding material led out of a bonding lead-out hole is heated and pressed to an adhering position while oscillating by a groove, by forming a groove in continuity to the bonding material lead-out hole of a capillary. CONSTITUTION:A groove 3 is formed in the bottom of the capillary 1 in continuity to the lead-out hole 2. Formation of the groove 3 enlarges the area of contact of the bonding material with the bottom of the capillary 1. Since the coefficient of friction with the bonding material increases, ultrasonic oscillation is effectively transmitted to the wire in bonding by thermosonic bonding. Besides, the bonding material can be strongly pressed to a bonding position while being oscillated at high speed by ultrasonic waves, and the scrubbing effect can be enhanced. |
