| 摘要 |
PURPOSE:To contrive to improve the reliability by enabling miniaturization and lamination because of the necessity of no outer components, by a method wherein resistors, conductors, component mount lands, etc. which are formed out of thick film paste and inductance elements formed out of thin film conductor are located mixingly. CONSTITUTION:The title substrate has the mixture of resistors, conductors, component mount lands, etc. which are formed out of thick film paste with inductance elements formed out of thin film conductor. After conductors 2, resistors 3, and an insulation layer 4 are print-calcined on an alumina ceramic substrate 1 with conductor paste and resistor paste, an NiCr-Au layer is continuously formed by vacuum evaporation. Then, inductance elements 5 made of the NiCr-Au layer is formed by photo etching. |
