发明名称 PLATING METHOD
摘要 PURPOSE:To obtain a plating film having a uniform compsn. and film thickness by moving back and forth a paddle made into the isosceles triangular shape which extends approximately perpendicularly in the flowing direction of a plating liquid and of which the base is parallel with the surface of a cathode, in the flowing direction of a plating liquid, in proximity to the surface of a substrate and the cathode. CONSTITUTION:The substrate 12 having many fine regions to be subjected to electrodeposition is supported on the cathode plate 13 provided on the base of a plating cell 11 and while the plating liquid is made to flow along the surface of the plate 13 and the substrate 12, electricity is conducted between the plate 13 and the anode 14 disposed above said plate to execute plating. The paddle 18 extending approximately perpendicularly in the flowing direction of the plating liquid is provided in proximity to the surface of the substrate 12 and the plate 13 in the cell 11 and is made into the isosceles triangular shape of which the base is parallel with the surface of the plate 13. The paddle 18 is supported by a frame 19 which is guided by a supporting guide. The forward and backward motion shown by A is applied to the paddle by a link-crank means 20 via a motor 21.
申请公布号 JPS61177392(A) 申请公布日期 1986.08.09
申请号 JP19850016500 申请日期 1985.02.01
申请人 TDK CORP 发明人 KATAYAMA KOKI;YOSHIDA MARIKO
分类号 C25D5/08 主分类号 C25D5/08
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