FITTING CONSTRUCTION OF SOLID-STATE IMAGE PICK-UP ELEMENT

摘要

PURPOSE:To radiate effectively heat and to suppress the temperature rise by transmitting most of the heat from a drive IC to a heat radiation plate and radiating the heat. CONSTITUTION:A pin 1a of a solid-state image pick-up element 1 is inserted into the hole of a heat slinger 8 and fitted to a circuit substrate 3. As the heat radiation plate is made from the substrate with a high thermal conductivity and a good insulating characteristic, by soldering the pin 1a inserted into the hole, adhesion with the radiation plate 8 is increased and the heat transfer is easily executed.