| 摘要 |
PURPOSE:To accomplish well-adhesive bonding by inhibiting the variability of wire bonding strength by adding a stitch side conductor flattening means which presses or presses and supersonically impresses the stitch side conductor. CONSTITUTION:Before wire bonding, a press head 9 is pressed on the sample so that its projection 9a may abut against the stitch side conductor 6, and pressing and supersonic waves are applied. This manner flattens the conductor 6 which has been in projection form before pressing by pressing. Thereafter, a sample fed downward a bonding means 20 from below a stitch side conductor flattening means 30 by a sample feed table 7 is subjected to wire bonding by the bonding means 20, wire bonding can be accomplished with good adhesive property, i.e. without stitch stripping. |
