| 摘要 |
PURPOSE:To enable miniaturization by reducing the mounting area more than mounting chip capacitors and chip resistors, by a method wherein a pellet with capacitors and resistors formed on an Si wafer out of thin films is mounted on a glass epoxy substrate. CONSTITUTION:A pellet 1 with capacitors and resistors formed on an Si wafer out of thin films is mounted on the glass epoxy substrate 2 with an adhesive 3. Next, the pads of th capacitor-resistor pellet 1 are connected to conductor patterns 4 on the substrate 2 with Au wires 5 by wire bonding. |
