| 摘要 |
PURPOSE:To feed an IC package intermittently on a plane surface as well as to enable to heat the package in a short period by a method wherein a plurality of grooves are formed in the direction where the package is carried on the heater block to be used to heat up the ceramic package. CONSTITUTION:On the surface of a heater block 2, a plurality of grooves M... are provided in carrying direction at the position corresponding to a plurality of connection pins attached to the contact surface of a pin grid array (PGA) IC package, and a guide G with which the ceramic part 5 of the PGA IC package 1 is guided to carrying direction is formed on both sides of the surface of the heater block 2. The PGA IC package 1 is transferred to a heater block 2a sliding on the upper surface of the heater block 2 by allowing the carrying pawl 3 of a carrying pawl mounting part 4 to perform an intermittent feeding movement, and the above-mentioned operation is repeated. |
