发明名称 |
ADHESION BETWEEN COPPER AND RESIN |
摘要 |
A method of bonding copper and a resin together is disclosed which comprises forming a copper oxide layer on the surface of copper to be bonded to a resin, reducing the copper oxide layer to metallic copper with a reducing solution, and bonding the metallic copper and the resin together. According to this method, a good acid resistance of the bonding interface and a sufficiently high bonding strength can be obtained. |
申请公布号 |
JPS61176192(A) |
申请公布日期 |
1986.08.07 |
申请号 |
JP19850016881 |
申请日期 |
1985.01.31 |
申请人 |
HITACHI LTD |
发明人 |
AKABOSHI HARUO;MURAKAMI KANJI;WAJIMA MOTOYO;FURUKAWA KIYONORI;TOBA RITSUJI;SHIMAZAKI TAKESHI |
分类号 |
B32B15/08;B32B15/088;B32B15/092;C08J5/12;C23C18/40;C23C22/05;C23C22/63;C23C22/83;H05K3/38;H05K3/42;H05K3/46 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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