发明名称 RESIN SEALED TYPE SEMICONDUCTOR DEVICE
摘要 PURPOSE:To suppress intrusion of moisture, by forming an element mounting part by an insulating material having excellent adhesion property with a sealing resin, and bonding and fixing the mounting part to one end of each lead in the sealing resin. CONSTITUTION:An element mounting part 6 is broadly formed by using an insulating material. The peripheral part of the mounting part is fixed to the lower surface of the end part of each lead 1 by a bonding agent and the like. An element 4 is mounted and fixed on the mounting part 6 by the bonding agent and the like. Thereafter, wire bonding and resin sealing are performed. Since the mounting part 6 is not exposed to the outside of a package directly, intrusion of moisture can be suppressed and reliability can be enhanced.
申请公布号 JPS61174755(A) 申请公布日期 1986.08.06
申请号 JP19850016290 申请日期 1985.01.30
申请人 TOSHIBA CORP;TOSHIBA MICRO COMPUT ENG CORP 发明人 TSUTSUI MITSUMASA
分类号 H01L23/50;H01L23/26;H01L23/28;H01L23/31 主分类号 H01L23/50
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