| 摘要 |
PURPOSE:To prevent a contact between semiconductor laser devices when semiconductor array laser devices are bonded to a radiating mount, by providing a plurality of grooves between the semiconductor laser devices. CONSTITUTION:An insulating film 72 and a resist film 73 are formed on a laser wafer 71, and the film 73 is etched to form a part 74 to be an electrode of a laser device and a window part 73-a to be a groove for separation of elements. Next, the insulating film 72 corresponding to these window parts 74 and 73-a is etched to form windows 75and 75-a, and then the resist is exfoliated. Next, a resist 76 is applied, a window 77 is opened only in a position corresponding to the groove, and by using this window 77, the laser wafer 71 is etched to form a groove 78. Next, the resist is exfoliated, a groove 79 is formed, and an electrode 81 is evaporated. By this constitution, a contact between semiconductor laser devices can be prevented when they are bonded to a radiating mount.
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