发明名称 WIRE BONDING APPARATUS
摘要 PURPOSE:To give ultrasonic wave vibration to the capillary so that the maximum wire bonding strength can be obtained in the lead extending direction and obtain good bonding condition by arranging almost orthogonaly a pair of ultrasonic wave horns, connecting the end portions of these horns and fixing the capillary to such connecting point. CONSTITUTION:A pair of ultrasonic wave generating apparatuses which respectively comprises ultrasonic wave transducers 18a, 18b, horn supporting portions 17a, 17b and horns 14a, 14b are used, the horns 14a and 14b are arranged almost orthogonally and the tip end portions of them are coupled with the coupling member 16 which is fixed through the capillary 15. A wire bonding apparatus is thus formed and the one born 14a is caused to make arc-sine vibration while the other horn 14b to make sine vibration which is leading in phase of 90 deg.. When the amplitude is the same, the center 15a of capillary 15 is caused to make the movement in true circle. Namely, each of the horns 14a, 14b is made to generate the vibration components of the parallel direction and orthogonal direction. Thereby, vibration can be transmitted effectively to the lead where the center region is bent.
申请公布号 JPS61174732(A) 申请公布日期 1986.08.06
申请号 JP19850016753 申请日期 1985.01.30
申请人 NEC KANSAI LTD 发明人 YAMAMOTO TADANORI
分类号 H01L21/60;H01L21/607 主分类号 H01L21/60
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