| 摘要 |
PURPOSE:To easily cope with offset by coordinate values between exposure apparatuses by processing the coordinate of chip for exposure as a sum of the coordinate of chip for the mark on a wafer, the coordinate of mark on the wafer for the mark on the holder and the coordinate of mark on the holder. CONSTITUTION:A desired chip 2 is applied to a wafer 1, a reference chip 3 which is the reference for wafer positioning is arranged, it is fixed to a wafer holder 4 with pins 6, 6 and these are placed on a stage of electron beam exposure apparatus. A position detection mark 5 is provided in the form of a bar code like a mark on the reference chip 3 on the holder 4. The coordinate (X, Y) of chip 2 is processed as a sum of the coordinate (xZ, yZ) of mark 5 on the holder 4, the coordinate of the ference chip 3 for the mark 5 and the coordinate of the chip of the reference chip 3. The chip positioning mark is seized by the scanning electron beam and the exposure can be done easily by giving a constant value to each exposure apparatus for the coordinate (xZ, yZ) which is nor related to the wafer. |
