摘要 |
PURPOSE:To prevent generation of dust by intervention of operator and improve the manufacuturing yield of semiconductor device by automatically supplying a wafer carrier housing the wafers having completed the cleaning process to the diffusion apparatus with a transfer means. CONSTITUTION:A cleaning and diffusion module 200 is constitured by providing a carrier transfer apparatus 100 to the one side and two diffusion apparatuses 102 and 103 to the other side sandwiching the semiconductor wafer cleaning apparatus 101. Within the cleaning apparatus 101, a throwing station 26 which is mounting the wafers before cleaning process and a transfer station 28 which stockes wafers after the cleaning process are provided and a liquid tank 32 and a drying apparatus 33 are provided between these stations. Next, an wafer carrier 20 within the station 26 is moved within such apparatus using a transfers robot 30 and the carrier 20 is housed to the send/receive buffers 34 and 36 by the rotation lifts 22 and 24. Thereafter, the carrier 20 is then moved to the transfer forks 39 and 40 therefrom and the desired diffusion processing is carried here. |