发明名称 SOLID IMAGE PICKUP DEVICE AND MANUFACTURE THEREOF
摘要 PURPOSE:To obtain a highly reliable sensor, which is stable against moisture and the like, by using an active metal alloy, in which In, Zn and Sb are added in Pb and Sn, as a sealing material for a solid image sensor element. CONSTITUTION:An annular sealing material 7 made of an active metal alloy, in which In, Zn and Sb are added in Pb and Sn, is held between a light transmitting glass plate 6 and the open end surface of a package 1. Pressure is applied and the device is heated to a temperature of 145-150 deg.C, which is lower than the melting point of the sealing material 7 at a rate of 1 deg.C/sec. When displacement is stopped, the heating is stopped. The device is cooled down to 120 deg.C or less. Pressure is removed and the device is completed.
申请公布号 JPS61174766(A) 申请公布日期 1986.08.06
申请号 JP19850014319 申请日期 1985.01.30
申请人 TOSHIBA CORP 发明人 YOSHINO TSUNEICHI;MURAMATSU KUNIO
分类号 H01L27/14;H01L31/0203;H04N5/335 主分类号 H01L27/14
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