| 摘要 |
<p>Methods and compositions are disclosed which entail the use of epoxy resins for absorbing moisture when moisture constraints are present. The moisture absorbing compositions include a curable epoxy resin, a curing agent, and an anhydride of a carboxylic acid, the latter in one instance being present in an amount sufficient both to cure the resin and to absorb the moisture. Alternatively, the anhydride moisture absorber is employed with a separate curing agent for the resin. Methods of protecting moisture-sensitive articles employ such compositions as adhesives or coatings, and the invention has particular utility in electronic device packaging.</p> |
