| 摘要 |
PURPOSE:To ensure accuracy of positioning in a bonding process, to enhance fabrication yield, and to improve product quality by a method wherein patterns are provided exclusively for the purpose of recognition. CONSTITUTION:The semiconductor device of this design is provided on its semiconductor substrate with patterns, in addition to an element electrode pattern, to be employed exclusively for the recognition of a bonding pad section to be used in an automatic wire-bonding process. That is to say, a pattern exclusively for such recognition is designed, not related with any element electrode pattern, with its shape, dimensions, arrangement, and the distance from element sections appropriately chosen. A pattern as simple as possible is preferred, preferably a square or cross with each of its sides not shorter than 50mums. Though there are not specifications on the distance between a recognition pattern and a nearby element, it is desired that it be as large as possible. A distance of 50mums or more ensures that there be virtually no ill effect on pattern recognition. As for the number of recognition patterns, a single-pattern setup does ensure excellent recognition and the use of two or more patterns ensures the best results. |
