Lead material for ceramic package IC.

摘要

A lead material for ceramic package ICs which comprises Ni 1.0-5.0 wt%. Co 0.2-1.0 wt%. Si 0.2-1.5 wt%, Zn 0.1-5.0 wt%. Cr 0.001-0.1 wt%, and Mn 0.02-1.0 wt%, with the remainder being Cu and inevitable impurities. It does not cause cracking to the ceramic substrate in the cooling step after silver soldering at 800 to 950°C, even though its coefficient of thermal expansion differs from that of ceramics. Moreover, it retains its high strength and conductivity after brazing.