发明名称 |
Thermosetting epoxy resin compositions |
摘要 |
What is disclosed are thermosetting epoxy resin compositions containing block siloxane copolymers which are used to induce low internal stress in the cured compositions and to provide coefficients of thermal expansion more closely aligned with the coefficients of thermal expansion of the substrates being molded therewith.
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申请公布号 |
US4604435(A) |
申请公布日期 |
1986.08.05 |
申请号 |
US19840672052 |
申请日期 |
1984.11.16 |
申请人 |
TORAY SILICONE CO., LTD. |
发明人 |
KOSHII, TARO;MORITA, YOSHITSUGU;SHINMI, HIDEO;HANADA, TSUNEO |
分类号 |
C09D5/03;C08G59/00;C08G59/40;C08G59/42;C08L63/00;C09D163/00;C09J163/00;H01B3/40;H01L23/29;H01L23/31;(IPC1-7):C08L63/00;C09J3/16 |
主分类号 |
C09D5/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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