发明名称 OPTICALLY ADHERING METHOD OF TRANSPARENT SUBSTRATE
摘要 PURPOSE:To obtain a uniform optically adhesive layer which obviates the sticking of dust and impurities and to make possible the simultaneous adhesion of multiple sheets of substrates by using a thermoplastic film consisting of embossed polyvinyl butyral, ethylene/vinyl acetate copolymer, etc. as the adhesive layer. CONSTITUTION:The embossed thermoplastic film is used as the adhesive layer in optical adhesion of at least two sheets of substrates including a flexible substrate. Embossing is effective in removing effectively the air existing between the substrates and the adhesive film in the stage of pasting the substrates and permits optical adhesion. A method for press welding under heating by heat rollers, a heating method in a vacuum pack, etc. are possible as the method of the pasting and the pasting at 60-100 deg.C is possible. The embossed thermoplastic film has no tack on the surface and does not capture dust. The dust picked up on the surface is easily removable by blowing with air, etc. or cleaning with water.
申请公布号 JPS61172117(A) 申请公布日期 1986.08.02
申请号 JP19840265649 申请日期 1984.12.17
申请人 SEIKO EPSON CORP 发明人 IWASHITA YUKIHIRO
分类号 G02F1/13;G09F9/00 主分类号 G02F1/13
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