发明名称 RESIN COMPOSITION FOR MOLDING ELECTRICAL AND ELECTRONIC PART
摘要 PURPOSE:To provide the titled composition having excellent moldability, abrasion resistance and dyeability, by compounding an ethylenic unsaturated nitrile- diene rubber-aromatic vinyl copolymer with a thermoplastic polyurethane elastomer and a thermoplastic polyester resin, etc. CONSTITUTION:The objective composition can be produced by mixing (A) 90-55 pts.(wt.) of an ethylenic unsaturated nitrile-diene rubber-aromatic vinyl copolymer, preferably an ABS resin with (B) 5-40pts., preferably 10-35pts. of an thermoplastic polyurethane elastomer (either of the ester-type one such as adipic acid polyester, carprolactone polyester etc. of the polyether-type one can be used) and (C) 5-30pts., preferably 10-25pts. of one or more resins selected from a thermoplastic polyester resin (e.g. PET, PBT, etc.), a polyacetal resin (e.g. polyoxymethylene homopolymer) and a polyamide resin (nylon). The mixing is carried out by dry-blending or melt-mixing.
申请公布号 JPS61171756(A) 申请公布日期 1986.08.02
申请号 JP19850009944 申请日期 1985.01.24
申请人 DENKI KAGAKU KOGYO KK 发明人 KOGA FUMIHIKO;KAKIYAMA HISAMITSU
分类号 C08L55/00;C08L7/00;C08L21/00;C08L51/00;C08L51/02;C08L55/02;C08L67/00;C08L75/00;C08L75/04;C08L77/00;H01B3/30;H01B3/44 主分类号 C08L55/00
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