| 摘要 |
PURPOSE:To improve the adhesive property by placing a protective glass plate on a protruding pattern provided on a protective film, and pressing the plate on the pattern. CONSTITUTION:Many thin film magnetic head patterns 9 are formed on a wafer 1 consisting, for example, of a ceramic, etc., and a protective film 10 is formed thereon by sputtering Al, etc. Alumina, SiO2, etc. are vapor-deposited on the film 10 to provide a protruding pattern 14 having specified height, a protective glass plate 12 is set on the protruding pattern 14, and then an adhesive (a resin 13) is filled. A weight 17 is placed on a cut pattern 16, and the adhesive is cured in a furnace to form a solid adhered film. The wafer protective film 10 formed in not affected by the thickness distribution of the protective film where the central part is thick and both ends are thin, the adhesive is uniformly distributed between the protective glass plate 12 and the wafer 1 because of the protruding pattern 14, and the thickness of the resin 13 is made uniform to improve the adhesive strength. |
