发明名称 SPUTTERING DEVICE
摘要 PURPOSE:To provide a titled device which converges the sputtering components of targets so as to have directivity, improves a film forming speed and has high efficiency by the constitution in which a substrate for forming the film is installed to face the open end face of a target cylindrical body consisting of an outside cylindrical body and inside cylindrical body. CONSTITUTION:The target which is the double cylindrical bodies consisting of the outside cylindrical body 11 having open both ends and the inside cylindrical body 12 having the smaller diameter concentrical therewith is provided in a vacuum chamber (not shown in fig.). Cooling pipes 13, 14 are respectively contained into the two targets 11, 12 to make the targets coolable with water and further earth shields 17, 18 which prevent sputtering are provided in required parts. The substrate 16 is installed on a substrate stage 15 installed to face one open end face A of the targets 11, 12 and a voltage is impressed to both; at the same time, a gas for sputtering is introduced therein. The components of the targets 11, 12 are thereby sputtered and the components thereof are converged into the substrate 16 so as to be efficiently stuck thereto.
申请公布号 JPS61170565(A) 申请公布日期 1986.08.01
申请号 JP19850012185 申请日期 1985.01.24
申请人 FUJITSU LTD 发明人 KUME TOMIO;SHINOHARA MASAKI;WAKAMATSU HIROAKI;KANDA HIDEKAZU;KIUCHI KATSUMI
分类号 C23C14/34;G11B5/85;G11B5/851 主分类号 C23C14/34
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