| 摘要 |
PURPOSE:To increase the film thickness only in a bonding part by vapor-depositing two layers on the bonding part by the lift-off method. CONSTITUTION:After the first metallic film 12 is formed on a piezoelectric substrate 11, a resist film 13 is applied. This substrate is processed to form an electrode 14. Next, only a bonding part 17 of the electrode 14 is exposed to light after applying a resist film 15 again, and the resist film 15 in the bonding part 17 is peeled. Thereafter, the resist film 15 is exposed to light again to modify the molecular structure of the film 15. The unnecessary film 15 is removed after the second metallic film 18 is stuck onto the resist film 15, thus obtaining an elastic surface wave device 20 where only the bonding part 19 on the electrode 14 is thick. |
