发明名称 METHOD FOR REMOVAL OF OXIDE FILM ON SURFACE OF SILICON SUBSTRATE
摘要 PURPOSE:To enable the removal of an oxide on a surface of a silicon substrate in an MOCVD system by supplying an organic gallium compound on a surface of the silicon substrate which is retained at high temperature. CONSTITUTION:On a surface of a silicon substrate which is retained at high temperature, an organic gallium compound is supplied. An organic gallium compound, e.g., (CH3)3Ga, (trimethyl gallium; TMG) (C2H5)3Ga, or (trimethyl gallium; TEG) is thermally decomposed at high temperature to produce Ga. The TMG or TEG supplied to the surface of a silicon substrate is decomposed on the surface of a substrate or in the vicinity of the surface and becomes Ga. Ga reduces SiO2 and purification of the surface of the silicon substrate can be done.
申请公布号 JPS61170021(A) 申请公布日期 1986.07.31
申请号 JP19850010246 申请日期 1985.01.23
申请人 SEIKO EPSON CORP 发明人 ITO NAOYUKI;OKAMOTO NORIHISA;SHIMOBAYASHI TAKASHI
分类号 H01L21/205;H01L21/302;H01L21/304 主分类号 H01L21/205
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