| 摘要 |
PURPOSE:To prevent the filling of a resin in the crack or the groove of a lead by forming projected lines which encroach in both the upper and the lower surfaces of the outer lead of a resin seal type semiconductor device at the position adjacent to the outside of a cavity on both an upper and a lower metal molds. CONSTITUTION:Low projected lines 71, 72a to the transverse direction of an outer lead which encroach in the upper and the lower surfaces of the outer lead 1A at the position outside of a cavity C are provided on the upper mold 71 and the lower mold 72 of a metal mold 7. The projected lines 71a, 72a pre vent the external flow of a resin leaking along the upper and the lower surfaces of the outer lead 1A from within the cavity C in a resin seal process. This prevents the adhesion of the resin to both the upper and the lower surfaces of the outer lead even if the both surfaces of the outer lead have a crack or a groove. |
