| 摘要 |
PURPOSE:To improve heat-dissipating characteristics particularly and economically by arranging a rubbery resin onto a contact surface between a conductive metallic support plate and an insulating plate and filling a clearance formed between both with the resin. CONSTITUTION:A conductive metallic support plate 3 to which a circuit pattern is shaped is prepared, a semiconductor element 4 is fixed to a bed section for the support plate 3, and an electrode for the semiconductor element and an external lead for the conductive metallic support plate 3 are connected by a small-gage wire in Al, Cu or the like. On the other hand, a heat-dissipating metallic support plate 1 in Al is prepared, and an insulating plate 2 is laminated on the support plate 1, but the insulating plate 2 is coated with a rubbery resin layer 5. A process is transferred to a sealing process through transfer molding. The heat-dissipating metallic support plate 1, the insulating plate 2 coated with the rubbery resin 5 and the conductive metallic support plate 3, to which the semiconductor element 4 is fixed, are superposed at predetermined positions, and a normal transfer molding process is executed. |
