HEAT-SEALING MULTILAYER FILM STRUCTURE AND MANUFACTURE THEREOF

摘要

Multi-layer structures, such as films of low coefficient of friction also having antistick characteristics over a wide temperature range during heat-sealing are disclosed. In accordance with a preferred embodiment, the films comprise an amide-containing polypropylene base layer and two heat sealable skin layers of a low stereoregularity polyolefin and microcrystalline wax. Methods for forming such structures are also disclosed.