发明名称 Apparatus for conveying and positioning circuit substrates of printed-wiring boards.
摘要 <p>@ An apparatus for conveying and positioning a substrate (20, 162) of a printed-wiring board, comprising: a conveyer system (34, 36) for transferring the substrate, including a pair of parallel spaced-apart side frames (42, 44) at least one of which is movable relative to the other; a positioning device (8) including a support member (10), a pair of parallel spaced-apart holder members (14, 18) disposed on the support member and movable relative to each other so as to be engageable with opposite sides of the substrate parallel to the side frames, to thereby hold the substrate (20, 162), and a device (72) for moving the support member along X and Y axes, so as to position the substrate within a predetermined area; a device (92, 96) for moving the support member between an aligned position in which the holder members are aligned with the side frames, and an unaligned position for positioning the substrate in the predetermined area; and a device (16, 66; 16, 166) for connecting the movable holder member (18) and the movable side frame (44) when the support member is in the aligned position. The distance between the holder members (14, 18) is variable with a change in the distance between the side frames.</p>
申请公布号 EP0189289(A2) 申请公布日期 1986.07.30
申请号 EP19860300313 申请日期 1986.01.17
申请人 FUJI MACHINE MFG. CO., LTD. 发明人 ASAI, KOICHI;TSUDA, MAMORU;KODAMA, JIRO
分类号 B65G47/88;H05K13/00;H05K13/04;(IPC1-7):H05K13/00 主分类号 B65G47/88
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